Temperature Dependency on Thermal Reliability Test Result by Sintered Silver Interconnection
نویسندگان
چکیده
منابع مشابه
Thermal Analysis of Sintered Silver Nanoparticles Film
Thin bonded films have many applications in antireflection and reflection coating, insulating and conducting films and semiconductor industries. Thermal conductivity is one of the most important parameter for power packaging since the thermal resistance of the interconnections is directly related to the heat removal capability and thermal management of the power package. The defects in material...
متن کاملStress Intensity of Delamination in a Sintered-Silver Interconnection: Preprint
In automotive power electronics packages, conventional thermal interface materials such as greases, gels, and phase-change materials pose bottlenecks to heat removal and are also associated with reliability concerns. The industry trend is toward high thermal performance bonded interfaces for large-area attachments. However, because of coefficient of thermal expansion mismatches between material...
متن کاملthermal analysis of sintered silver nanoparticles film
thin bonded films have many applications in antireflection and reflection coating, insulating and conducting films and semiconductor industries. thermal conductivity is one of the most important parameter for power packaging since the thermal resistance of the interconnections is directly related to the heat removal capability and thermal management of the power package. the defects in material...
متن کاملThermo-Mechanical Reliability of Sintered-Silver Joint versus Lead-Free Solder for Attaching Large-Area Devices
This study mainly evaluated the thermo-mechanical reliability of lead-free packaging techniques for attaching large-area chip. With 3 MPa pressure, a low-temperature (<300 o C) sintering technique enabled by a nano-scale silver paste was developed for attaching 100 mm 2 silicon die. This new lead-free packaging technique for die-attachment was compared with soldering by vacuum reflow. Lead-free...
متن کاملSintered silver finite element modelling and reliability based design optimisation in power electronic module
This paper discusses the design for reliability of a sintered silver structure in a power electronic module based on the computational approach that composed of high fidelity analysis, reduced order modelling, numerical risk analysis, and optimisation. The methodology was demonstrated on sintered silver interconnect sandwiched between silicon carbide chip and copper substrate in a power electro...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: The Proceedings of Mechanical Engineering Congress, Japan
سال: 2020
ISSN: 2424-2667
DOI: 10.1299/jsmemecj.2020.j22302